South Korea’s Hynix Semiconductor Inc. says they have developed the industry’s fastest and smallest one-gigabyte chip for mobile phones and other portable gadgets.
The new 1GB mobile DRAM operates at a maximum clock speed of 200MHz resulting in a throughput of up to 1.6 GBps with a 32-bit I/O. Hynix said the product consumes very low power, under worst case conditions, extending battery life in a wide range of portable electronic devices.
Hynix plans to begin mass production from the first quarter of 2008. The product will be available as ‘NAND flash Multi-Chip Package (NAND MCP)’, which combines DRAM and NAND flash in a single package, or ‘package-on-package (POP)’ stack. It will also be offered as ‘KGD (Known Good Die)’ for System in Package (SIP) applications.
[Site: Hynix.com]
[Via: Business Wire]