South Koreaâ€™s Hynix Semiconductor Inc. says they have developed the industryâ€™s fastest and smallest one-gigabyte chip for mobile phones and other portable gadgets.
The new 1GB mobile DRAM operates at a maximum clock speed of 200MHz resulting in a throughput of up to 1.6 GBps with a 32-bit I/O. Hynix said the product consumes very low power, under worst case conditions, extending battery life in a wide range of portable electronic devices.
Hynix plans to begin mass production from the first quarter of 2008. The product will be available as â€˜NAND flash Multi-Chip Package (NAND MCP)â€™, which combines DRAM and NAND flash in a single package, or â€˜package-on-package (POP)â€™ stack. It will also be offered as â€˜KGD (Known Good Die)â€™ for System in Package (SIP) applications.