OmniVision is offering an upside down approach to digital imaging with its OmniBSI (backside illumination) technology, turning the sensor upside down so that it collects light through what was previously the backside of the sensor.
Current front side illumination (FSI) sensors can block or deflect light from reaching the pixel, according to the company, and this novel approach optimizes light absorption. OmniVision developed OmniBSI architecture with the support of its long-time foundry and process technology partner, Taiwan Semiconductor Manufacturing Corporation (TSMC).
OmniVision claims that the OmniBSI architecture delivers a number of performance improvements over FSI, including increased sensitivity per unit area, improved quantum efficiency and reduced cross talk and photo response nonuniformity, which all lead to significant improvements in image quality. Since light directly strikes the silicon, the fill factor of the image sensor is significantly improved so as to deliver best-in-class low-light sensitivity.
OmniVision is currently demonstrating an 8 MegaPixel, OmniBSI CameraChip sensor, and expects to start sampling the first products before the end of June.