IBM Develops New 3-D Chip Stacking Technology

IBM Wafer Showing 3-D Chip Stacking Technology

IBM says it has found a new way to make computer chips that greatly reduces the size of the overall chip package and speeds up the rate of data flow. It’s a three-dimensional technique that could extend Moore’s Law beyond its expected limits.

This 3-D chip stacking is called “through-silicon vias.” It allows various chip components to be packed much closer together for faster, smaller, and lower-power systems.

With this IBM breakthrough it is now possible to move from horizontal 2-D chip layouts to 3-D chip stacking, which takes chips and memory devices that traditionally sit side by side on a silicon wafer and stacks them together on top of one another.

The “vias,” which are essentially vertical connections etched through the silicon wafer and filled with metal, eliminates the need for long metal wires to connect the chips together.

[Via: Domino.Research.IBM.com]

Chris Malinao

About Chris Malinao

Chris teaches Lightroom as workflow software to photography students at the FPPF, Federation of Philippine Photographers Foundation. He also teaches smartphone photography.

PENTAX 35mm Camera Bundle 4 bodies 8 lenses Motor ME K1000 ProgramA Spotmatic et picture
PENTAX 35mm Camera Bundle 4 bodies 8 lenses Motor ME K1000 ProgramA Spotmatic et
Vintage Asahi Pentax Viewfinder Flash Mount Shoe For Spotmatic Film Camera picture
Vintage Asahi Pentax Viewfinder Flash Mount Shoe For Spotmatic Film Camera
Honeywell Pentax Spotmatic W/ Quantaray 85-210mm & 28mm Lens picture
Honeywell Pentax Spotmatic W/ Quantaray 85-210mm & 28mm Lens
Vintage Honeywell Pentax Spotmatic SP II Camera Body Only - Works picture
Vintage Honeywell Pentax Spotmatic SP II Camera Body Only - Works
Honeywell Pentax Spotmatic F 35mm camera Vintage with case, lens, and working picture
Honeywell Pentax Spotmatic F 35mm camera Vintage with case, lens, and working