IBM says it has found a new way to make computer chips that greatly reduces the size of the overall chip package and speeds up the rate of data flow. Itâ€™s a three-dimensional technique that could extend Mooreâ€™s Law beyond its expected limits.
This 3-D chip stacking is called â€œthrough-silicon vias.â€ It allows various chip components to be packed much closer together for faster, smaller, and lower-power systems.
With this IBM breakthrough it is now possible to move from horizontal 2-D chip layouts to 3-D chip stacking, which takes chips and memory devices that traditionally sit side by side on a silicon wafer and stacks them together on top of one another.
The â€œvias,â€ which are essentially vertical connections etched through the silicon wafer and filled with metal, eliminates the need for long metal wires to connect the chips together.